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Product introduction of polyimide solution (PAA)
The test method | unit | PAA-1 | PAA-2 | PAA-4005 | |
Physical properties of | |||||
appearance | -- | -- | Brown, transparent liquid |
Yellow transparent liquid | Yellow transparent liquid |
solid content（%） | -- | -- | 15 -20 | 10 -20 | 40 -60 |
density | ASTM D 792 | g/cm3 | 1.0-1.1 | 1.0-1.1 | 0.9 -1.0 |
Viscosity (30 ℃) | mpa.s | 8000-20000 | 10000-25000 | 400-1000 | |
Mechanical properties of (plate after molding) | (after fiber compound) | ||||
Tensile strength (20℃) | ASTM D 638 | MPa | 100 | 100 | 200 |
Bending strength (20℃) | ASTM D 790 | Mpa | 130 | -- | 400 |
Compression strength (20℃) | ASTM D 695 | Mpa | 140 | 150 | 200 |
Impact strength of simply supported beam (no gap) | GB/T 1043 | kJ/m2 | 100 | 20 | -- |
Thermal performance | |||||
Tg(N2, 10℃/min) | DSC | ℃ | 256 | 380 | 315 |
Td5(Air, 10℃/min) | TGA | ℃ | 510 | 520 | -- |
HDT(1.82MPa,N2, 10℃/min) | ASTM D 648 | ℃ | 250 | 350 | -- |
Coefficient of thermal expansion | ASTM D 696 | /℃ | 5.0×10-5 | 3.8×10-5 | -- |
electrical | |||||
Dielectric strength | ASTM D 149 | kV/mm | 100 | 100 | 25 |
Dielectric constant (1MHz, 20℃) | ASTM D 150 | - | 3.2 | 3.4 | 4.5 |
Surface resistivity | ASTM D 257 | Ω | 1014 | 1014 | 1014 |
Remark:
1. Mechanical property, thermal property and electrical property data refer to the characteristic value of the product solidified into a plate, and the mechanical property will be higher if it is made into a film.
2. Special requirements can be customized (viscosity, solid content, etc.).
3. Thermoplastic paa-1 series (paa-1002, paa-1003) has better flexibility.
4. High-temperature paa-2 series products have better high-temperature resistance.
Paa-4005 is a special type of high temperature composite materials, solution low viscosity, low boiling point, easy to impregnate and curing operation.
6. The main USES of polyimide solution are: wear-resistant coating, self-lubricating coating, anticorrosive coating and insulating coating on metal surface; Packaging of electronic products; Fiber optic surface signal shielding; Binder for special materials; Composite matrix resin, etc.
Polyimide solution (PAA series) heat treatment process
Temperature (℃) | time（min） | note |
80 | 10-30 |
Preheat treatment section. |
120 | 10-30 | |
150-180 | 20-30 | Desolvent section, treated slowly, can effectively avoid bubbling. |
200 | 0-10 | |
220 | 10-20 | |
250 | 10-30 | The cyclic section can increase the mechanical properties of the product. |
260-280 | 10-20 | The paa-1 series may not need this section. |
Remark:
1. The above is the reference process for PI film processing (20-50um) or filling and sealing material processing, in which the segmented parts and time are determined according to the size or thickness of the product, which can be fine-tuned.
2. Clean water or oil on the contact surface before processing.
3. Above is the processing method in the blast oven, or vacuum oven can be used (exhaust gas absorption is better).
4. If high temperature curing condition is not available (above 250℃), it can also be cured at 160℃ to 200℃. This period of time needs to be extended, but the electrical property and adhesion will be slightly lower.
5. Do not apply it too thick at one time, and do not apply it for a period of time at low or medium temperature. Otherwise, the solvent will not evaporate in time, and the product will bubble or performance will decrease.
6. Paa-4005 is specially used for composite materials, and the processing technology is introduced separately.
7. Polyimide solution needs to be kept away from light, dry, avoid contact with water, at -5/(-18)℃. The shelf life is 30 days at room temperature and 90 days frozen.